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Samsung, IBM Forge 65-nm Chip Alliance
Samsung Electronics is joining a strategic semiconductor technology development partnership with IBM, Chartered Semiconductor Manufacturing and Infineon. Initially, the four companies will focus on 65 nanometer (nm) technology and will extend, over time, to include 45 nm process development.
The technology alliance will reinforce the IBM technology-based design point for next-generation logic technologies, thus providing an industry-wide platform for CMOS logic processes.
Joint development takes place at IBM's 300 mm Advanced Semiconductor Technology Center in East Fishkill, N.Y., which began operation in July of 2003. Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities.
"Samsung is pleased to join this elite partnership, further enhancing technology and supporting services and accelerating market application of cutting edge technologies," said Dr. Chang Gyu Hwang, President and CEO of Samsung Electronics' Semiconductor Business, "This alliance is expected to create a technology platform for nano-scale CMOS logic processes, enabling customers to enjoy a broader offering of the next-generation logic process technologies."
A separate agreement with IBM will give Samsung license rights to 90nm CMOS logic technology. Samsung plans to introduce IBM's proven logic technology to its highly integrated System-On-Chip (SOC) product line such as HD-TVs, DVDPs, and mobile applications. Based on Samsung's SOC business infrastructure, the advanced logic technology will be available to Samsung's internal and external customers, expanding IBM-based technology sourcing.
"The participation of Samsung, a worldwide technology leader, along with our current prestigious partners, makes IBM's New York-based chip facility the worldwide center of expertise for silicon research and development," said Dr. John E. Kelly III, senior vice president and group executive, Technology, IBM Systems and Technology Group. "With our existing partners, Chartered and Infineon, we welcome Samsung. Together we will create a global technology platform, providing clients with consistent chip making methods and multiple sources."
The technology alliance will reinforce the IBM technology-based design point for next-generation logic technologies, thus providing an industry-wide platform for CMOS logic processes.
Joint development takes place at IBM's 300 mm Advanced Semiconductor Technology Center in East Fishkill, N.Y., which began operation in July of 2003. Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities.
"Samsung is pleased to join this elite partnership, further enhancing technology and supporting services and accelerating market application of cutting edge technologies," said Dr. Chang Gyu Hwang, President and CEO of Samsung Electronics' Semiconductor Business, "This alliance is expected to create a technology platform for nano-scale CMOS logic processes, enabling customers to enjoy a broader offering of the next-generation logic process technologies."
A separate agreement with IBM will give Samsung license rights to 90nm CMOS logic technology. Samsung plans to introduce IBM's proven logic technology to its highly integrated System-On-Chip (SOC) product line such as HD-TVs, DVDPs, and mobile applications. Based on Samsung's SOC business infrastructure, the advanced logic technology will be available to Samsung's internal and external customers, expanding IBM-based technology sourcing.
"The participation of Samsung, a worldwide technology leader, along with our current prestigious partners, makes IBM's New York-based chip facility the worldwide center of expertise for silicon research and development," said Dr. John E. Kelly III, senior vice president and group executive, Technology, IBM Systems and Technology Group. "With our existing partners, Chartered and Infineon, we welcome Samsung. Together we will create a global technology platform, providing clients with consistent chip making methods and multiple sources."
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